Since its birth, laser technology has received extensive attention and gradually expanded its application areas. Laser technology has brought fundamental changes to the manufacturing industry: In the aerospace industry, the successful application of laser welding of aluminum alloys is a technological revolution in the aircraft manufacturing industry. In the automotive industry, laser processing technology optimizes the structure of automobiles, improves vehicle performance, and reduces fuel consumption. Laser finishing and micromachining not only promoted the development of the microelectronics industry, but also provided favorable conditions for the semiconductor manufacturing industry. Laser processing technology is a non-contact processing method, so it does not produce mechanical extrusion or mechanical stress, especially in line with the processing requirements of the semiconductor industry. Laser processing technology has been widely used in the semiconductor industry due to its high efficiency, non-pollution, high accuracy, and small heat affected zone.
Laser processing technology in the application of dicing and cutting The laser processing technology has been widely used in dicing. At present, the most widely used laser scribing technology in the industry is that the laser directly acts on the surface of the scribe line of the wafer. The energy of the laser light causes the material on the affected surface to be detached, thereby achieving the purpose of removal and cutting. Recently, a new concept laser scribing machine introduced in Japan has abandoned the traditional direct action of the surface, and takes the action of silicon crystals in the silicon substrate, destroying its single crystal structure, creating an easily-deformed deformation layer in the silicon substrate. Then, the chips are separated from each other by the subsequent disintegrating process. In order to achieve the stress-free, no chipping, no heat damage, no pollution, anhydrous cutting effect.
With the continuous development of science and technology, laser processing technology has also been applied to the wafer cutting process by some manufacturers. With sophisticated software control, many small-diameter wafers can be processed on one wafer. Compared with traditional rounding methods, this type of operation causes less damage to the wafer and a relatively larger amount of chips.
At the upcoming Shanghai Laser and Optoelectronic Expo in Shanghai New International Expo Center on March 15-17, 2011, the laser processing equipment exhibition area of ​​Halls E3 and E4 will present a laser processing industry cluster with a certain scale. High-end products such as Trump TruMicro, TruPulse, Rufin Micro-Precision Machining Group, China Semiconductor Wafer Laser Dicing Machine, DeLong Laser Picosecond Laser Fine Micromachining Equipment, Suzhou Tianhong Wafer Laser Dicing Machine and Infrared Laser Dicing machines, etc. will lead the industry in cutting-edge technology.
Laser Marking Technology in Wafer Processing Laser marking is a new contactless, non-polluting, non-abrasive marking process. In the wafer processing process, in order to effectively enhance the traceability of the wafer, it also provides certain convenience for production management. The laser identification code can be produced at a specific position of the wafer. This technology has become a potential industry standard and is widely Applied to silicon materials, germanium materials.
Laser Marking Leader Trump Express TruMark, Luofen Marking-Marking Business Group, Huagong Fiber Laser Marking Machine, Shenyang Xinsong Robot Fiber Laser Marking Machine, Delong Laser Ultraviolet Laser Fine Micromachining Equipment, Suzhou Tianhong UV Laser marking machines will lead the domestic laser micro-machining products.
Laser Testing Technology Laser testing techniques include laser triangulation and particle testing. In laser triangulation, the surface of the wafer is scanned with a finely focused laser beam, and the optical system focuses the reflected laser light onto the detector. When detecting the topography of microbumps, 3D laser triangulation has obvious advantages in accuracy, speed, and detectability. In particle testing, particle control is an important step in the process of wafer processing and device manufacturing, and particle monitoring is very important. There are two working principles of particle testing equipment, one is light scattering method; the other is extinction method.
In March, the Shanghai Laser and Photonics Exhibition in Munich opened a special area of ​​“Measurement and Testing Technologyâ€. Leading companies such as PI, Ocean Optics, Bidtec, Avantes, etc. will all compete at the Shanghai Laser and Photonics Fair in Munich in March. Athletics, show their strengths.
The unique advantages of lasers determine its wide application in semiconductor technology. The ups and downs of China's semiconductor industry over the past 10 years, the use of laser technology has injected new vitality into the semiconductor manufacturing industry, and played an indispensable role in its recovery and recovery. With the rapid development of integrated circuit technology. The scope of laser application will be further expanded and extended.
Laser processing technology in the application of dicing and cutting The laser processing technology has been widely used in dicing. At present, the most widely used laser scribing technology in the industry is that the laser directly acts on the surface of the scribe line of the wafer. The energy of the laser light causes the material on the affected surface to be detached, thereby achieving the purpose of removal and cutting. Recently, a new concept laser scribing machine introduced in Japan has abandoned the traditional direct action of the surface, and takes the action of silicon crystals in the silicon substrate, destroying its single crystal structure, creating an easily-deformed deformation layer in the silicon substrate. Then, the chips are separated from each other by the subsequent disintegrating process. In order to achieve the stress-free, no chipping, no heat damage, no pollution, anhydrous cutting effect.
With the continuous development of science and technology, laser processing technology has also been applied to the wafer cutting process by some manufacturers. With sophisticated software control, many small-diameter wafers can be processed on one wafer. Compared with traditional rounding methods, this type of operation causes less damage to the wafer and a relatively larger amount of chips.
At the upcoming Shanghai Laser and Optoelectronic Expo in Shanghai New International Expo Center on March 15-17, 2011, the laser processing equipment exhibition area of ​​Halls E3 and E4 will present a laser processing industry cluster with a certain scale. High-end products such as Trump TruMicro, TruPulse, Rufin Micro-Precision Machining Group, China Semiconductor Wafer Laser Dicing Machine, DeLong Laser Picosecond Laser Fine Micromachining Equipment, Suzhou Tianhong Wafer Laser Dicing Machine and Infrared Laser Dicing machines, etc. will lead the industry in cutting-edge technology.
Laser Marking Technology in Wafer Processing Laser marking is a new contactless, non-polluting, non-abrasive marking process. In the wafer processing process, in order to effectively enhance the traceability of the wafer, it also provides certain convenience for production management. The laser identification code can be produced at a specific position of the wafer. This technology has become a potential industry standard and is widely Applied to silicon materials, germanium materials.
Laser Marking Leader Trump Express TruMark, Luofen Marking-Marking Business Group, Huagong Fiber Laser Marking Machine, Shenyang Xinsong Robot Fiber Laser Marking Machine, Delong Laser Ultraviolet Laser Fine Micromachining Equipment, Suzhou Tianhong UV Laser marking machines will lead the domestic laser micro-machining products.
Laser Testing Technology Laser testing techniques include laser triangulation and particle testing. In laser triangulation, the surface of the wafer is scanned with a finely focused laser beam, and the optical system focuses the reflected laser light onto the detector. When detecting the topography of microbumps, 3D laser triangulation has obvious advantages in accuracy, speed, and detectability. In particle testing, particle control is an important step in the process of wafer processing and device manufacturing, and particle monitoring is very important. There are two working principles of particle testing equipment, one is light scattering method; the other is extinction method.
In March, the Shanghai Laser and Photonics Exhibition in Munich opened a special area of ​​“Measurement and Testing Technologyâ€. Leading companies such as PI, Ocean Optics, Bidtec, Avantes, etc. will all compete at the Shanghai Laser and Photonics Fair in Munich in March. Athletics, show their strengths.
The unique advantages of lasers determine its wide application in semiconductor technology. The ups and downs of China's semiconductor industry over the past 10 years, the use of laser technology has injected new vitality into the semiconductor manufacturing industry, and played an indispensable role in its recovery and recovery. With the rapid development of integrated circuit technology. The scope of laser application will be further expanded and extended.
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