New Fusion Mixed Signal FPGA Device

Microsemi CorporatiON announced that it will provide 100% Fusion mixed-signal FPGA devices that have been tested over the -55°C to +100°C temperature range. This performance enhancement enables Microsemi to bring the unique hybrid signal synthesis benefits of Fusion devices to the military, aerospace, and defense industries that must maintain high reliability at extreme temperatures. Designers can take advantage of the inherent reprogrammability, high reliability, and non-volatile features of Fusion devices, as well as the added benefit of firmware error immunity. In addition, Fusion mixed-signal FPGAs integrate analog and digital components in a single chip, which significantly reduces board space.

Fusion FPGA device extended temperature range models have been fully tested over the entire temperature range of -55°C to +100°C and are available with 600,000 and 1.5 million equivalent system gates at two densities and up to 223 user I/s O. The device can easily implement power sequencing and monitoring functions as well as monitor and manage voltage, temperature, and current under extreme temperature conditions. The Fusion Mixed Signal FPGA Extended Temperature Range is ideal for high reliability applications such as military weapons and down wing aircraft systems that must operate in extreme environments.

Ken O'Neill, director of marketing for high-reliability products at SoC’s SoC product division, said: "For industrial and military applications such as harsh environments, the use of highly reliable components is critical. Offering a long history of high-reliability devices and testing devices in extreme temperature environments, we will continue to provide unique products tailored to the military and aerospace market, providing the industry with significant added value.”