In general, power loss, thermal effects, and other factors can reduce the overall luminous efficiency of a lighting fixture to 30% to 50% of the luminous efficiency of the LED package itself, that is, 50 lm/W to 70 lm/W. However, many manufacturers have recently introduced products with overall luminous efficiency higher than 80 lm/W. Although it is not comparable to a high-frequency fluorescent tube with a luminous efficiency close to 100 lm/W, the improvement in LED luminous efficiency is very rapid.
For example, the overall luminous efficiency of a small reflective LED bulb marketed in 2008 was only 68 lm/W (white light), while the overall luminous efficiency of the new LED bulb introduced by Toshiba Lighting Technology in 2009 reached 81.9 lm/W (see 4202). Billion yen table 1). In other words, in just one year, the luminous efficiency of LED lighting fixtures has increased by 20%. If we continue to move forward at this speed, then from 2011 to 2012, the overall luminous efficiency of LED products will be able to exceed 100lm/W.
On the other hand, the price of LEDs is also falling sharply. In some cases, the overall cost of LED lighting (lighting fixtures plus electricity bills) has outperformed fluorescent lighting solutions. For LED bulbs with a brightness equivalent to 60W, the total cost of the 40,000-hour life cycle is about 10,000 yen; the same is 40,000 hours of lighting. When using incandescent lamps, since the life of each bulb is only 1000 hours, the total cost will be More than 50,000 yen; when using fluorescent bulbs, the cost is about 16,000 yen (see Figure 4). When the cumulative lighting time exceeds 14,000 hours, the overall cost of the LED bulb will be better than that of the fluorescent bulb. It can be seen that LED lighting has a long-term cost advantage.
Figure 4 Overall cost of three lighting fixtures
According to the Japan LED Association, by the end of 2012, the cost per unit of brightness of LEDs will drop to 1 yen per lumen. This is a key goal for practical use. In fact, this date will likely be significantly advanced. Tian Qideng of Nichia Chemical Industry Co., Ltd. explained: "At present, the annual decline in LED lighting prices is above 20%. I don't think the price decline will slow down in the future."
Manufacturers will gradually stop producing and selling incandescent lamps. The luminous efficiency of LED lamps will exceed that of fluorescent lamps. The practical target of 1 yen per lumen will be realized... Considering these factors together, one conclusion can be drawn: By 2012, LED lighting will be A lot of popularity. New and old lighting manufacturers are striving to develop new LED lighting products to meet the market opportunities of substantial growth in the next three years.
Technological innovation to create high quality and low price LED to open the practical door
At present, the price of LED lighting is several times to several times that of traditional lighting, and the threshold is higher for companies and ordinary consumers. The price of these products is high because of the key components of the LED chip/package. In addition, cost control of peripheral circuits such as power supplies and enclosures is also very important.
In terms of brightness, the overall luminous efficiency of LED lamps is still inferior to that of high-frequency fluorescent tubes. LED chip manufacturers are improving their luminous efficiency through innovations in chip and package architecture and materials. Higher luminous efficiency not only reduces packaging costs, but also reduces heat generation. In addition, thermal performance is also a critical factor. If the heat generated in the LED package can be efficiently released, the life of the LED can be extended and the luminous efficiency can be improved.
Simple and cheap
The biggest obstacle to popularizing LED lighting is price. The desire of ordinary consumers and LED bulb wholesalers to cut prices is very strong. Let's take the example of Toshiba Lighting Technology's LED bulbs to analyze how to reduce costs.
The company's products use a die-cast aluminum housing with an LED package mounted on a metal substrate above the housing, on which an acrylic semi-spherical dome is placed to scatter light. The aluminum case contains a resin case for mounting the power supply board (see Figure 5). There are 16 heat sinks outside the aluminum case for dissipating power and the heat generated by the LED package.
Figure 5 Structure of the LED bulb
The new and old products do not differ much in the shape of the outer casing, but the new product has no coating, directly uses the bare aluminum surface, and the decorative ring is omitted, thus controlling the cost.
The internal power circuits are quite different. In the original product, a filler was used on the inner side of the power circuit board in the resin case; in the new product, since the circuit board was large, no filler was used. The engineer will thin the surface in contact with the metal substrate to expand the power supply space. In addition, for power boards, the use of phenolic paper instead of glass epoxy can also reduce costs. Of course, a thinner casing also helps to reduce material costs.
The LED packages for both new and old products are produced by Nichia Chemical Industry Co., Ltd. The old LED package includes 6 parallel chips, and the new model includes only 3 serial chips. This design change reduces the supply current and thus reduces power supply heating.
Arrange 400 LEDs
ROHM is working to improve LED packaging to reduce costs. The company's small spotlights feature an array of 400 LED packages, each with a footprint of 1.6mm to 0.8mm and an output power of 0.1W.
Recently, many LED lighting devices have used high-brightness LED packages of more than 1W, and the trend is to reduce the number of LED packages. However, Sifang Xiu Ming, head of the lighting division of the production unit of the discrete module of Roma, said that the company found it cheaper to use a large number of low-brightness LEDs.
At present, the general-purpose LED package has been mass-produced and the price is very cheap. In addition, since a large number of miniature LED chips are used in each package, the average variation in package characteristics can be kept to a minimum. In addition, the company is developing other types of LED lighting, including light bulbs, basic lighting and linear lighting. These products use LEDs with an output of 0.5W and a size of 2mm to 4mm. The number of LEDs in LED bulbs exceeds 70, and the number of LEDs in basic and linear illumination is more than 400.
Thermal technology contributes to higher power output
ROHM is able to install so many low-light chips at a lower cost because they can package themselves and use the company's existing equipment for installation. In order to reduce the cost of procurement, installation, etc., many other manufacturers tend to use high-brightness chips.
When a high-brightness chip is used, the heat source is concentrated, so heat dissipation is very important. Japan's Multi-Task company service department reminded: "In 2 to 3 years, the industry will reach the limit of natural heat dissipation." The demand for brighter lighting will lead to an increase in heat output.
When the LED heats up, the forward voltage and luminous efficiency will decrease and the service life will be shortened. High-brightness packages tend to generate a lot of heat and require expensive thermal resistance materials to further increase costs. In other words, thermal radiation is a key factor affecting LED luminous efficiency, cost and longevity.
As high-brightness packages increase, more and more LED lighting designs use metal substrates, and at the same time, it is increasingly difficult to ensure that these substrates have sufficient heat dissipation capabilities. Therefore, the industry has proposed many new substrate structures that can efficiently dissipate heat.
Nippon Electric Chemical Industry Co., Ltd. developed the AGSP (Advanced Grade Solid-bump Process) substrate technology using the technology of Daiwa Kougyo Co., Ltd. to improve the heat dissipation performance. The structure embeds a copper pillar having a high thermal conductivity in the insulating resin, so that heat generated by the LED can be transmitted to the outside of the package through the copper pillar (see FIG. 6). As long as the heat sink, the outer casing, and the like are in physical contact with each other, efficient heat dissipation can be achieved by this method. Mr. Mi Cunzhi, Minister of Electronic Materials Business of Electrochemical Industry Co., Ltd. said: "When the brightness of LED lamps is equivalent to 40W incandescent lamps, the metal substrate is sufficient to solve the heat dissipation problem; when the brightness of LED lamps is equivalent to 100W incandescent lamps, AGSP substrate technology is needed. The diameter of the copper post is about 4 mm, enough to mount the LED chip.
Figure 6 AGSP technology provides excellent thermal performance
In order to achieve high thermal conductivity, high-brightness LEDs are usually coated with ceramic and silver paste on an AlN (aluminum nitride) substrate, but AlN is expensive to produce. Although the heat dissipation performance of AGSP is not as good as that of ceramic substrate, its cost performance is better. At present, the Electrochemical Industry Corporation is conducting mass production evaluation, and its goal is to achieve full-scale commercial operation in 2010.
Although the AGSP substrate is relatively inexpensive, there is still a need to further reduce costs because it is currently twice as costly as a metal substrate. The company hopes to improve copper column forming technology and achieve mass production, thereby reducing costs to a level comparable to metal substrates.
For example, the overall luminous efficiency of a small reflective LED bulb marketed in 2008 was only 68 lm/W (white light), while the overall luminous efficiency of the new LED bulb introduced by Toshiba Lighting Technology in 2009 reached 81.9 lm/W (see 4202). Billion yen table 1). In other words, in just one year, the luminous efficiency of LED lighting fixtures has increased by 20%. If we continue to move forward at this speed, then from 2011 to 2012, the overall luminous efficiency of LED products will be able to exceed 100lm/W.
On the other hand, the price of LEDs is also falling sharply. In some cases, the overall cost of LED lighting (lighting fixtures plus electricity bills) has outperformed fluorescent lighting solutions. For LED bulbs with a brightness equivalent to 60W, the total cost of the 40,000-hour life cycle is about 10,000 yen; the same is 40,000 hours of lighting. When using incandescent lamps, since the life of each bulb is only 1000 hours, the total cost will be More than 50,000 yen; when using fluorescent bulbs, the cost is about 16,000 yen (see Figure 4). When the cumulative lighting time exceeds 14,000 hours, the overall cost of the LED bulb will be better than that of the fluorescent bulb. It can be seen that LED lighting has a long-term cost advantage.
Figure 4 Overall cost of three lighting fixtures
According to the Japan LED Association, by the end of 2012, the cost per unit of brightness of LEDs will drop to 1 yen per lumen. This is a key goal for practical use. In fact, this date will likely be significantly advanced. Tian Qideng of Nichia Chemical Industry Co., Ltd. explained: "At present, the annual decline in LED lighting prices is above 20%. I don't think the price decline will slow down in the future."
Manufacturers will gradually stop producing and selling incandescent lamps. The luminous efficiency of LED lamps will exceed that of fluorescent lamps. The practical target of 1 yen per lumen will be realized... Considering these factors together, one conclusion can be drawn: By 2012, LED lighting will be A lot of popularity. New and old lighting manufacturers are striving to develop new LED lighting products to meet the market opportunities of substantial growth in the next three years.
Technological innovation to create high quality and low price LED to open the practical door
At present, the price of LED lighting is several times to several times that of traditional lighting, and the threshold is higher for companies and ordinary consumers. The price of these products is high because of the key components of the LED chip/package. In addition, cost control of peripheral circuits such as power supplies and enclosures is also very important.
In terms of brightness, the overall luminous efficiency of LED lamps is still inferior to that of high-frequency fluorescent tubes. LED chip manufacturers are improving their luminous efficiency through innovations in chip and package architecture and materials. Higher luminous efficiency not only reduces packaging costs, but also reduces heat generation. In addition, thermal performance is also a critical factor. If the heat generated in the LED package can be efficiently released, the life of the LED can be extended and the luminous efficiency can be improved.
Simple and cheap
The biggest obstacle to popularizing LED lighting is price. The desire of ordinary consumers and LED bulb wholesalers to cut prices is very strong. Let's take the example of Toshiba Lighting Technology's LED bulbs to analyze how to reduce costs.
The company's products use a die-cast aluminum housing with an LED package mounted on a metal substrate above the housing, on which an acrylic semi-spherical dome is placed to scatter light. The aluminum case contains a resin case for mounting the power supply board (see Figure 5). There are 16 heat sinks outside the aluminum case for dissipating power and the heat generated by the LED package.
Figure 5 Structure of the LED bulb
The new and old products do not differ much in the shape of the outer casing, but the new product has no coating, directly uses the bare aluminum surface, and the decorative ring is omitted, thus controlling the cost.
The internal power circuits are quite different. In the original product, a filler was used on the inner side of the power circuit board in the resin case; in the new product, since the circuit board was large, no filler was used. The engineer will thin the surface in contact with the metal substrate to expand the power supply space. In addition, for power boards, the use of phenolic paper instead of glass epoxy can also reduce costs. Of course, a thinner casing also helps to reduce material costs.
The LED packages for both new and old products are produced by Nichia Chemical Industry Co., Ltd. The old LED package includes 6 parallel chips, and the new model includes only 3 serial chips. This design change reduces the supply current and thus reduces power supply heating.
Arrange 400 LEDs
ROHM is working to improve LED packaging to reduce costs. The company's small spotlights feature an array of 400 LED packages, each with a footprint of 1.6mm to 0.8mm and an output power of 0.1W.
Recently, many LED lighting devices have used high-brightness LED packages of more than 1W, and the trend is to reduce the number of LED packages. However, Sifang Xiu Ming, head of the lighting division of the production unit of the discrete module of Roma, said that the company found it cheaper to use a large number of low-brightness LEDs.
At present, the general-purpose LED package has been mass-produced and the price is very cheap. In addition, since a large number of miniature LED chips are used in each package, the average variation in package characteristics can be kept to a minimum. In addition, the company is developing other types of LED lighting, including light bulbs, basic lighting and linear lighting. These products use LEDs with an output of 0.5W and a size of 2mm to 4mm. The number of LEDs in LED bulbs exceeds 70, and the number of LEDs in basic and linear illumination is more than 400.
Thermal technology contributes to higher power output
ROHM is able to install so many low-light chips at a lower cost because they can package themselves and use the company's existing equipment for installation. In order to reduce the cost of procurement, installation, etc., many other manufacturers tend to use high-brightness chips.
When a high-brightness chip is used, the heat source is concentrated, so heat dissipation is very important. Japan's Multi-Task company service department reminded: "In 2 to 3 years, the industry will reach the limit of natural heat dissipation." The demand for brighter lighting will lead to an increase in heat output.
When the LED heats up, the forward voltage and luminous efficiency will decrease and the service life will be shortened. High-brightness packages tend to generate a lot of heat and require expensive thermal resistance materials to further increase costs. In other words, thermal radiation is a key factor affecting LED luminous efficiency, cost and longevity.
As high-brightness packages increase, more and more LED lighting designs use metal substrates, and at the same time, it is increasingly difficult to ensure that these substrates have sufficient heat dissipation capabilities. Therefore, the industry has proposed many new substrate structures that can efficiently dissipate heat.
Nippon Electric Chemical Industry Co., Ltd. developed the AGSP (Advanced Grade Solid-bump Process) substrate technology using the technology of Daiwa Kougyo Co., Ltd. to improve the heat dissipation performance. The structure embeds a copper pillar having a high thermal conductivity in the insulating resin, so that heat generated by the LED can be transmitted to the outside of the package through the copper pillar (see FIG. 6). As long as the heat sink, the outer casing, and the like are in physical contact with each other, efficient heat dissipation can be achieved by this method. Mr. Mi Cunzhi, Minister of Electronic Materials Business of Electrochemical Industry Co., Ltd. said: "When the brightness of LED lamps is equivalent to 40W incandescent lamps, the metal substrate is sufficient to solve the heat dissipation problem; when the brightness of LED lamps is equivalent to 100W incandescent lamps, AGSP substrate technology is needed. The diameter of the copper post is about 4 mm, enough to mount the LED chip.
Figure 6 AGSP technology provides excellent thermal performance
In order to achieve high thermal conductivity, high-brightness LEDs are usually coated with ceramic and silver paste on an AlN (aluminum nitride) substrate, but AlN is expensive to produce. Although the heat dissipation performance of AGSP is not as good as that of ceramic substrate, its cost performance is better. At present, the Electrochemical Industry Corporation is conducting mass production evaluation, and its goal is to achieve full-scale commercial operation in 2010.
Although the AGSP substrate is relatively inexpensive, there is still a need to further reduce costs because it is currently twice as costly as a metal substrate. The company hopes to improve copper column forming technology and achieve mass production, thereby reducing costs to a level comparable to metal substrates.
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