Comment: LED packaging development and integration capabilities are equally important

● The epitaxial and thermal dissipation structure of the chip is important, and the subsequent package thermal design is equally important.

● Domestic LED packaging technology has made great progress, but still lacks original technology.

● Advances in packaging technology do not represent the maturity of market development capabilities, and the gap between domestic companies is here.


With the development of the LED industry, the industry's view on the LED industry chain is gradually changing. In the past, the importance of upstream chip and epitaxial growth technology has been emphasized. Now, packaging technology is more important because of LED heat dissipation, light efficiency and reliability. Sex and so on are closely related to the level of packaging.

According to experts, there are many core technologies involved in LED packaging. In addition to the advanced nature of packaging equipment, it also includes packaging structure, wire bonding parameter optimization technology, chip, best matching technology of phosphor and glue, and glue baking technology. The continuous improvement of these processes and technologies is also the only way to develop low thermal resistance, excellent optical characteristics and high reliability LED products.

Technology differentiation is one of the main manifestations of the competitiveness of high-tech companies, as well as in the packaging industry. From the perspective of the current domestic LED industry, there are many enterprises, but there are not many large-scale and competitive enterprises. The main reason is that most enterprises do not differentiate in packaging technology and do not make real technology. The content of the product. In some areas, after the success of an LED company, other local companies have followed suit, and the equipment has been launched, but the process and technology research and development are not mature. This has led to the production of LED products that are not ideal for light efficiency and service life. Therefore, the research and improvement of packaging technology is the basic condition for packaging companies to gain competitiveness.

However, from the perspective of the industry chain as a whole, the importance of the packaging process is not only the technology itself, but more importantly, it closely links the development route of LED technology with the market demand of downstream applications. Applications without technical support are not possible, and technologies that do not consider requirements do not have strong vitality. The packaging company is the combination of the two to achieve the development of the LED market.

Because of this, the core competitiveness of the packaging enterprise lies in the degree of follow-up of the upstream chip technology development and the insight into the downstream application market.

After some LED packaging companies succeeded, they infiltrated upstream and began to develop chips and epitaxy, which is called vertical integration by the industry. Therefore, some people believe that the domestic LED industry has begun to move toward vertical integration. In the author's view, at this stage, the purpose of this integration is not necessarily the expansion of the business scope of the business, and there are few companies in China that have chip research and development capabilities. These research and development are mostly in the laboratory stage. Not on mass production. Enterprises are now doing the purpose of chip research and development, in fact, in order to obtain more competitiveness in the packaging business. Because in essence, the route of the package is determined by the epitaxy and the chip. Because the design of the epitaxial and chip structure has basically determined the subsequent soldering mode of the LED, it also basically determines the package form that can be taken. Therefore, the company's research on upstream chips and extensions is precisely to take a step forward in packaging technology.

What cannot be ignored is that the differentiation of packaging technology also needs to be realized through the research capabilities of the market. In addition to focusing on the upstream, packaging must also focus on the development of the downstream application market, so that the direction of technology research and development is in line with the application needs. In fact, the gap between China's packaging companies and internationally advanced enterprises lies in their ability to research downstream markets. For example, in the rapid development of the small and medium size backlight market in 2009, domestic companies did not gain a lot of market share, although domestic enterprises have matured in small and medium size backlight LED packaging technology. The main reason is that there is no opportunity to grasp the market.

The innovation of LED technology in the world is also based on the market-oriented, pushing the light source structure and package structure in the target application direction, and then pushing back to the chip and epitaxial design. Therefore, domestic packaging companies need to do a lot of work to gain competitiveness. They should not only stay at the level of process and structure research and equipment, but really grasp the true connotation of packaging.

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The company is  improved all the time by working together with many industrial leading partners, today, LBY, the name means reliable quality, good consistency, high light efficiency and cost effective. We now have 22 domestic offices and maintain very good relationships with our distributors from more than 50 countries. The local servicecover most products users no matter where they locate. The company is also very actively providing its products and service to national projects and government signs.

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Declaration

  • Warranty: 5 years.
  • In order to ensure the safety, the broken wires needs to be replaced by the manufacturer or the service agent,
  • or by the staff with the similar qualification.
  • The given data in the specification was based on the laboratory testing, there may be discrepancy found in the actual products.
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