Automotive chip multilayer ceramic capacitors provide high reliability and greater capacity

Monolithic ceramic capacitors contribute to the miniaturization, digitization and high frequency of electronic equipment. Using Murata's ceramic technology and original materials, it can provide ultra-small, high-capacity, low-ESR and high-frequency capacitors, especially for automotive capacitors and safety-certified capacitors that require high reliability. Murata's vehicle-specific ceramic capacitor product line has been expanded to include high-capacity products, and has added products that can meet high-end requirements, such as products that can withstand high temperatures of 150 ° C, small products, temperature cycle resistance and substrates. Resin electrode products with excellent performance and excellent performance meet the needs of auto manufacturers and in-vehicle equipment manufacturers.

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Murata's main product for sheet-type multilayer ceramic capacitors for automotive applications is the "GCM Series" that meets automotive reliability requirements. This series of products has the following characteristics: meets the requirements of AEC-Q200 standard; nickel separator terminal gives high resistance to solder leaching, suitable for reflow soldering and wave soldering; R7/C7/5C series operating temperature range: -55 to 125 ° C; available in a variety of sizes from 3.2 x 2.5 x 2.5 mm in length to width x 0.6 x 0.3 x 0.3 mm; paper or embossed tape and Packaged for automatic placement; lead-free products.

Capacitors widely used in electronic devices include sheet-like multilayer ceramic capacitors, tantalum capacitors, and aluminum electrolytic capacitors. The ceramic capacitor is extruded from a high dielectric constant capacitor ceramic (barium titanate titanate) into a circular tube, a disk or a disk as a medium, and is plated with silver on the ceramic as an electrode by a fire infiltration method. It is divided into two types: high frequency porcelain and low frequency porcelain. The full name of tantalum capacitor is tantalum electrolytic capacitor, which is also a kind of electrolytic capacitor. It uses metal crucible as medium. It does not use electrolyte like ordinary electrolytic capacitor. Tantalum capacitor does not need to be coated with aluminum film capacitor like ordinary electrolytic capacitor. It has almost no inductance, but it also limits its capacity. It is characterized by long life, high temperature resistance, high accuracy, excellent filter high frequency conversion performance, but the capacity is small, the price is more expensive than the aluminum capacitor, and the voltage and current resistance are weak. Since the capacitance of the chip-shaped multilayer ceramic capacitor is smaller than that of other types of capacitors, the previous use is limited. If the problem of large capacity is solved smoothly, tantalum capacitors and aluminum electrolytic capacitors can be replaced with more reliable chip multilayer ceramic capacitors.

Murata has achieved a steady increase in the variety of chip-type multilayer ceramic capacitors in the range of 4.7μF to 100μF with tantalum capacitors as the mainstream. The maximum electrostatic capacity of the GCM series has reached 47μF (withstand voltage of 6.3V). Variety. Among the capacitors used in in-vehicle equipment, the proportion of multi-layer ceramic products is expected to increase rapidly in the future.

In order to increase the electrostatic capacity of the chip multilayer ceramic capacitor, the key is to thin the dielectric layer. The chip-shaped multilayer ceramic capacitor employs a structure in which a plurality of dielectric bodies formed of a sheet-like ceramic are stacked. The more the number of layers of the laminated dielectric body, the larger the electrostatic capacity. Therefore, by thinning the dielectric body and increasing the number of layers, the electrostatic capacity can be increased while maintaining the size of the component. However, only thinning the dielectric body may result in a loss of reliability such as a drop in withstand voltage. In order to solve these problems, techniques such as miniaturization of particles constituting a dielectric body and planarization of electrodes and dielectrics are indispensable. With the advantage of one-stop development from materials to manufacturing equipment, Murata continues to provide capacitors with larger capacity.

In addition, Murata has also introduced a small car-mounted product developed using the above dielectric thin layer technology. That is, "0402 product" (1.0 × 0.5mm) GCM15 series and "0201 product" (0.6 × 0.3mm) GCM03 series. As the number of electrical equipment in a limited space of a car continues to increase, the demand for miniaturization will become higher and higher, and the demand for smaller 0201 products will gradually increase.

Because the "mechatronics" trend of directly packaging electronic circuits in places with particularly high temperatures in engines and gearboxes has increased, the upper limit of the operating temperature range of automotive components has increased to 150 °C. In response to this demand, Murata has introduced products with an operating temperature range of -55 ° C to 150 ° C. Since it is difficult to package with solder at more than 150 ° C, a 150 ° C high temperature guaranteed product "GCG Series" which can be packaged with a conductive adhesive is also available. The application of the conductive adhesive is achieved by replacing the Ni/Sn layer disposed on the surface of the copper electrode with Ag/Pd.

In order to meet the requirements of automotive manufacturers and in-vehicle equipment manufacturers to further improve reliability, Murata has developed the "GCJ Series" which uses a conductive resin for the bottom layer of external electrodes. It is characterized by the work of the external electrode and the internal dielectric can be prevented from cracking when subjected to an external force. The GCJ series employs an autonomous structure in which a resin electrode is provided on a copper electrode at the lowermost layer of the external electrode, and Ni/Sn plating treatment is performed on the outer side. Further, by optimizing the shape of the external electrode or the like, the amount of stress applied to the internal dielectric body when subjected to a physical external force is suppressed. When subjected to a large stress, the resin electrode layer is easily peeled off, and cracking can be prevented after the dielectric body is subjected to a large stress.

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